| 摘要 |
<p>The present invention provides a retainer ring for CMP machines. The retainer ring includes an upper retaining member (110), which is coupled to a head of a CMP machine, and a lower retaining member (120), which is integrally provided under the upper retaining member and polished along with a wafer. A support protrusion (124) is provided on the lower retaining member and is in contact with the lower surface of the upper retaining member to define a gap for applying adhesive between the upper and lower retaining members. Therefore, the retainer ring according to the present invention markedly enhances bonding force between the upper and lower retaining members, thus reliably preventing the lower retaining member which is made of engineering plastic from becoming separated from the upper retaining member.</p> |
