| 发明名称 |
Abrichtvorrichtung und Poliervorrichtung |
| 摘要 |
A dressing apparatus (14) is used for dressing a polishing surface of a polishing table (10) used for polishing a workpiece such as a semiconductor wafer. The dressing apparatus (14) comprises a dresser having a dressing surface for dressing the polishing surface, and the dressing surface has an area which covers an entire area of the polishing surface (10). <IMAGE> |
| 申请公布号 |
DE60041674(D1) |
申请公布日期 |
2009.04.16 |
| 申请号 |
DE2000641674 |
申请日期 |
2000.05.17 |
| 申请人 |
EBARA CORP. |
发明人 |
WAKAYABASHI, SATOSHI;YAMAGUCHI, KUNIAKI;TOGAWA, TETSUJI;TAKADA, NOBUYUKI;NABEYA, OSAMU |
| 分类号 |
B24B37/04;B24B53/02;B24B1/04;B24B37/00;B24B53/00;B24B53/007;B24B53/017;B24B53/12;B24B55/06;H01L21/302;H01L21/304 |
主分类号 |
B24B37/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
