发明名称 HIGH-TEMPERATURE POLYAMIDE MOLDING COMPOUND REINFORCED WITH FLAT GLASS FIBER
摘要 <P>PROBLEM TO BE SOLVED: To provide a new reinforced polyamide molding compound based on high-melting point polyamide, which has a high distortion temperature with excellent mechanical properties and processing characteristics. <P>SOLUTION: In the reinforced polyamide molding compound containing a high-melting point polyamide and a flat glass fiber, the polyamide is a partial aromatic polyamide having at least DSC melting point of 270&deg;C, and the flat glass fiber has particularly a rectangular cross section, i.e., a noncircular cross-sectional area, the dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis being 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compound and a molded article manufactured therefrom, i.e., in particular an injection-molded part. The inventive molded part has a high transverse stiffness and transverse strength. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009079212(A) 申请公布日期 2009.04.16
申请号 JP20080211180 申请日期 2008.08.19
申请人 EMS-PATENT AG 发明人 HARDER PHILLIPP;JELTSCH THOMAS;LAMBERTS NIKOLAI
分类号 C08L77/00;B29C45/00;B29K77/00;C08K7/14 主分类号 C08L77/00
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