| 发明名称 |
ELECTROLESS DEPOSITION FROM NON-AQUEOUS SOLUTIONS |
| 摘要 |
A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
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| 申请公布号 |
US2009095198(A1) |
申请公布日期 |
2009.04.16 |
| 申请号 |
US20080338998 |
申请日期 |
2008.12.18 |
| 申请人 |
NORKUS EUGENIJUS;JACIAUSKIENE JANE;DORDI YEZDI |
发明人 |
NORKUS EUGENIJUS;JACIAUSKIENE JANE;DORDI YEZDI |
| 分类号 |
C23C18/38 |
主分类号 |
C23C18/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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