| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a constitution of a semiconductor device having: wirings for electrically connecting between a semiconductor chip and the outside, and sealed by resin; and a part exposing from the resin in the semiconductor chip without a bonding wire and a molding resin used. <P>SOLUTION: Part of the semiconductor chip 10 is directly bonded to a thermoplastic resin constituting the resin substrate 20 to be covered by the resin substrate 20, a chip connection terminal 22 electrically connected to the semiconductor chip 10 is provided on the bonded surface 20e with the semiconductor chip 10 on the resin substrate 20 as the remnant of the semiconductor chip 10 away from the resin substrate 20, an external connection terminal 23 electrically connected to the outside is provided on the surface 20b other than the bonded surface 20e of the resin substrate 20, and the chip connection terminal 22 and the external connection terminal 23 are conducted by an internal wiring 21 in the substrate 20. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
