发明名称 SOLDER ALLOY, SOLDER BALL USING IT, AND SOLDERED PART EXCELLENT IN DROP IMPACT RESISTANCE
摘要 PROBLEM TO BE SOLVED: To provide a solder alloy, a solder ball and a soldered part which satisfy requirements for melting points and mechanical strength and also are excellent in drop impact resistance. SOLUTION: The invented solder alloy contains 0.1-2.0 mass% Ag, 0.05-2.0 mass% Zn, and the balance being Sn and inevitable impurities and is excellent in drop impact resistance. The invented solder ball is formed by spheroidizing the solder alloy. The soldered part is formed by connecting the solder alloy and solder ball to an Ni electrode. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009078299(A) 申请公布日期 2009.04.16
申请号 JP20080080909 申请日期 2008.03.26
申请人 HITACHI METALS LTD 发明人 DATE MASAYOSHI;WAKANO MOTOKI
分类号 B23K35/26;C22C13/00;H05K3/34 主分类号 B23K35/26
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