发明名称 PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
摘要 <p>A pressure sensor for a pressure medium includes: a sensor chip (3) including a semiconductor substrate (3a), a diaphragm (3b) in the substrate and a gauge resistor (3c) on the diaphragm; a protection cap (5) covering the diaphragm; a case (2) for accommodating the chip, introducing the pressure medium to the cap, and atmospheric air to the substrate; a terminal (2c); a wiring (4); and a seal member (7). An embedded portion (4a-4c, 4e) of the wiring is coupled with the gauge resistor. A connection portion (4d, 4f) of the wiring couples the embedded portion and the terminal. The embedded portion is covered with the cap to be isolated from the pressure medium. The seal member is disposed between the case and the substrate to isolate the connection portion from the pressure medium and the atmospheric air.</p>
申请公布号 EP2047224(A1) 申请公布日期 2009.04.15
申请号 EP20080711430 申请日期 2008.02.12
申请人 DENSO CORPORATION 发明人 TANAKA, HIROAKI;FUJII, TETSUO
分类号 G01L9/00 主分类号 G01L9/00
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