发明名称 |
MICROFLUIDIC ARCHITECTURE |
摘要 |
<p>A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.</p> |
申请公布号 |
EP1740384(B1) |
申请公布日期 |
2009.04.15 |
申请号 |
EP20050745214 |
申请日期 |
2005.04.26 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
SHAARAWI, MOHAMMED;HICKEY, KENNETH;O'REILLY, WILL |
分类号 |
B41J2/16 |
主分类号 |
B41J2/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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