| 发明名称 |
High temperature packaging for semiconductor devices |
| 摘要 |
<p>A method of forming multiple bonds (20,22) on an electronic device (10) includes heating first bonding metals at a predetermined temperature to form a first bond (20) comprising a first melting temperature above the predetermined temperature. The first bond (20) and second bonding metals (32',34') are then heated at the predetermined temperature to form a second bond (22) comprising a second melting temperature above the predetermined temperature.</p> |
| 申请公布号 |
EP2048710(A1) |
申请公布日期 |
2009.04.15 |
| 申请号 |
EP20080252405 |
申请日期 |
2008.07.15 |
| 申请人 |
PRATT & WHITNEY ROCKETDYNE INC. |
发明人 |
HERTEL, THOMAS A.;TAN, DANIEL |
| 分类号 |
H01L21/98;H01L21/60 |
主分类号 |
H01L21/98 |
| 代理机构 |
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代理人 |
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| 主权项 |
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