| 摘要 |
A substrate processing apparatus and method are provided to improve the cleaning efficiency of substrate by preventing the degradation of the cleaning efficiency of substrate due to the supporting member. The transport unit transfers wafer to the first cleaning part(200) and the second cleaning unit. The transport unit comprises the first robot arm(110) and the second robot arm. The first robot arm comprises the first arm and guide rail. The second robot arm comprises the second arm and guide rail. The first process bath(210) comprises the first housing(212), the first boat(214), and the first blow nozzle(216) and the first supply line(218). The first housing has the inner bath(212a) and the outer bath(212b). The second process bath(220) comprises the second housing(222), the second boat(224), and the second blow nozzle(226) and the second supply line(228).
|
