发明名称 MOUNTING METHOD, MOUNTING STRUCTURE, METHOD FOR MANUFACTURING ELECTRONIC EQUIPMENT, ELECTRONIC EQUIPMENT, METHOD FOR MANUFACTURING LIGHT EMITTING DIODE DISPLAY, AND LIGHT EMITTING DIODE DISPLAY
摘要 <p>Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably with high positional precision by: forming an element holding layer 12, which is made of a material whose viscosity can be controlled, on a substrate 11; controlling the viscosity of a first part 12a of the element holding layer 12, which includes a mounting region for an element, into a viscosity making the element naturally movable, and controlling the viscosity of a second part 12b of the element holding layer 12 outside the first part 12a into a viscosity making the element naturally immovable; and after mounting one element 13 in the first part 12a, controlling the viscosity of the first part 12a into the viscosity making the element 13 naturally immovable.</p>
申请公布号 EP2048704(A1) 申请公布日期 2009.04.15
申请号 EP20070767530 申请日期 2007.06.25
申请人 SONY CORPORATION 发明人 TOMODA, KATSUHIRO;DOI, MASATO;TAKAGISHI, TOSHIYA;KANEMITSU, TOSHIAKI
分类号 H01L21/52;G09F9/33;H01L23/00;H01L33/00;H01L33/10;H01L33/32;H01L33/52;H01L33/62;H05K3/30 主分类号 H01L21/52
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