| 摘要 |
A manufacturing device of a semiconductor device is provided to isolate a plurality of wafers from an adjacent wafer by separating a storage space of each boat through a plate. A manufacturing device(100) of a semiconductor device includes a boat(120) and a chamber(140). The boat stores a plurality of wafers(110). The chamber stores the boat. The chamber is formed by a vacuum and a clean room in order to isolate the wafers from outside. A heating heater heats an inner part of the chamber into 800~1200°C. A cooling device cools an inner part of a heated chamber. A gas supply device supplies O2, N2, and the other chemical gas. A transfer device loads the boat on the inner part of the chamber. The boat includes a plurality of loading parts(132) in order to load a plurality of wafers. A plate(134) isolates a wafer storage space in order to prevent degradation of a precision of an oxide film.
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