发明名称 |
Hole in pad thermal management |
摘要 |
<p>A device and method of heat sinking a surface mount device (SMD) component. The method includes: forming through holes in a printed circuit board (PCB), electroless plating a first copper layer in the holes, standard plating a second copper layer in the holes and surrounding surfaces of the PCB, masking and pulse plating a third copper layer in the holes, filling the holes with non-conductive material and sanding flush with the second copper layer, electroless plating a fourth copper layer on the PCB over the area of the holes, plating a fifth copper layer (or pad) on the PCB over the area of the holes, and attaching a surface mount device to the fifth copper layer.</p> |
申请公布号 |
EP2048921(A2) |
申请公布日期 |
2009.04.15 |
申请号 |
EP20080166117 |
申请日期 |
2008.10.08 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
TULLIDGE, LEE H.;DE OTO, LEONARD;LARSON, TIM;O'KEEFE, PATRICK;GERTZ, HERB |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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