发明名称 Semiconductor device
摘要 In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between the area to which the semiconductor element is fixed and wire connection areas to which the wires are connected, the groove being formed so as to surround the semiconductor element fixing area, thereby preventing peeling-off between the tab to which the semiconductor element is fixed and the resin which constitutes the package.
申请公布号 US7518156(B2) 申请公布日期 2009.04.14
申请号 US20030664978 申请日期 2003.09.22
申请人 RENESAS TECHNOLOGY CORP.;HITACHI HOKKAI SEMICONDUCTOR LTD. 发明人 HASEBE HAJIME;DANNO TADATOSHI;SATOU YUKIHIRO
分类号 H01L23/12;H01L33/00;H01L21/60;H01L23/02;H01L23/31;H01L23/495;H01L23/50 主分类号 H01L23/12
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