发明名称 |
Structure of high performance combo chip and processing method |
摘要 |
A method for fabricating a chip package is achieved. A seed layer is formed over a silicon wafer. A photoresist layer is formed on the seed layer, an opening in the photoresist layer exposing the seed layer. A first solder bump is formed on the seed layer exposed by the opening. The photoresist layer is removed. The seed layer not under the first solder bump is removed. A second solder bump on a chip is joined to the first solder bump.
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申请公布号 |
US7517778(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20070901079 |
申请日期 |
2007.09.14 |
申请人 |
MEGICA CORPORATION |
发明人 |
LEE JIN YUAN;LIN MOU-SHIUNG |
分类号 |
H01L21/20;H01L21/56;H01L23/31;H01L23/538;H01L25/065 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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