A multilayer printed circuit board ("PCB") coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly/downwardly, but also inwardly/outwardly in a regular, repeating pattern.
申请公布号
WO2009045888(A2)
申请公布日期
2009.04.09
申请号
WO2008US77830
申请日期
2008.09.26
申请人
ACCESS BUSINESS GROUP INTERNATIONAL LLC;BAARMAN, DAVID, W.;SCHWANNECKE, JOSHUA, K.;GUTHRIE, WARREN, E.;WAHL, RICHARD, A.;DUCKWORTH, PAUL
发明人
BAARMAN, DAVID, W.;SCHWANNECKE, JOSHUA, K.;GUTHRIE, WARREN, E.;WAHL, RICHARD, A.;DUCKWORTH, PAUL