| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that it is difficult to fully automate a releasing process of separating a substrate-resin sealed body composite body (or a metal plate-resin sealed body composite body when a substrate is a metal plate) finished by resin sealing into a resin sealed body and a substrate (the metal plate) since the releasing process is essential for electroforming package technique and a plating layer is formed directly on the substrate. SOLUTION: In the releasing process for an electroforming package in this manufacturing method, the substrate-resin sealed body composite body 3 and the operation point of pressing force in a direction where the substrate and resin sealed body 2 are released from each other are relatively moved to move the operation point backward from a tip portion of an outer portion of the substrate while the pressing force is applied to the tip portion of the outer portion of the substrate, thereby automatically separating the substrate-resin sealed body composite body 3 into the substrate and resin sealed body 2. COPYRIGHT: (C)2009,JPO&INPIT
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