发明名称 THERMAL HEAD, MANUFACTURING METHOD OF THERMAL HEAD, AND IMAGE PRINTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a highly-reliable thermal head which ensures a thickness of a resin layer at both ends of a substrate and does not easily cause cracks in the resin and to provide a manufacturing method of the thermal head and an image printing device. SOLUTION: In the thermal head, a plurality of heating resistive elements 24 and an integrated circuit 26 which controls heating of the heating resistive elements 24 are disposed on the substrate with a step 30 provided therebetween. The thermal head has a connecting means 28 which electrically connects the plurality of heating resistive elements 24 and the integrated circuit 26 to each other. At the part of the substrate where the connecting means 28 is not provided, a resin shape reinforcing means 46 is provided so as to be adjacent to the connecting means. A protective resin is provided so as to cover the integrated circuit 26, the connecting means 28, and the resin shape reinforcing means 46. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009073110(A) 申请公布日期 2009.04.09
申请号 JP20070245728 申请日期 2007.09.21
申请人 TDK CORP 发明人 ANDO SUGI;MIYASHITA ISATO
分类号 B41J2/345;B41J2/335 主分类号 B41J2/345
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