| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment which can dissipate heat of a heat generating component in the electronic equipment with high efficiency while keeping a small size, and attains high maintainability and the cost reduction. SOLUTION: The electronic equipment 1 is provided with: a base 21 to which a main heat generating component 31 is fitted; a heat sink 2 comprising a plurality of fins 22 provided on the opposite side from the surface where the main heat generating component 31 is fitted; and a case 4 where the main heat generating component 31 and a printed wiring board 41 are accommodated by being combined with the heat sink 2 and an air through-hole 41 is provided vertically, wherein the base 21 of the heat sink 2 is provided with a base extension portion 23 extended horizontally to cover the top of the case 4 of the electronic equipment 1, and the base extension portion 23 is provided with a plurality of second fins 24. Further, the base extension portion 23 is provided with a heat sink air through-hole 27 communicating with the air through-hole provided on the case, and the heat sink air through-hole 27 is provided between the plurality of second fins. COPYRIGHT: (C)2009,JPO&INPIT
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