| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film with a separator having appropriate mold release force, exhibiting excellent handling ease in peeling work and the like and having excellent slit property and punching workability, and to provide an adhesive film for a flexible printed wiring board using it. SOLUTION: In the adhesive film with a separator, an adhesive film layer is provided on the side, to which a mold release agent is applied, in the separator formed by layering a film coated with alkyd resin-based mold release agent and paper. The adhesive film layer is formed of an adhesive comprising (A) an elastomer, (B) a thermosetting resin, and (C) a curing agent. The mold release force between the separator and the adhesive film layer is preferably 50-150 mN/10 mm in a peel test. COPYRIGHT: (C)2009,JPO&INPIT
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