APPARATUS AND METHOD FOR CUTTING SUBSTRATE USING ULTRASHORT PULSED LASER BEAM

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for cutting substrates using an ultrashort pulsed laser beam, which perform fast and high-accuracy cutting by a simple process regardless of kinds of glasses which are slightly different depending on uses and characteristics of displays.

SOLUTION: The substrate cutting apparatus using the ultrashort pulsed laser beam comprises a laser beam generating means which generates ultrashort pulsed laser beams and a focusing means which adjusts the focus of the ultrashort pulsed laser beam to the inside of the substrate to be cut. An internal filamentation phenomenon is induced by irradiation along a desired cutting path while the ultrashort pulsed laser beam is focused on the inside of the substrate, so that a cut groove is formed inside the substrate. This method enables substrates used for various types of displays to be cut quickly and accurately by the simple process without causing any crack or break.

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