发明名称 |
LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Provided are: a light emitting module capable of ensuring a high heat-dissipating property and mountable in any of sets in various shapes; and a method for manufacturing the light emitting module. The light emitting module mainly includes: a metal substrate; an insulating layer covering the upper surface of the metal substrate; a conductive pattern formed on the upper surface of the insulating layer; and a light emitting element fixedly attached to the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, a groove is formed in the metal substrate, and then the metal substrate is bent. Thus, a bent portion is formed in the metal substrate.
|
申请公布号 |
US2009090928(A1) |
申请公布日期 |
2009.04.09 |
申请号 |
US20080238235 |
申请日期 |
2008.09.25 |
申请人 |
SANYO ELECTRIC CO., LTD.;SANYO SEMICONDUCTOR CO., LTD.;SANYO CONSUMER ELECTRONICS CO., LTD. |
发明人 |
MORI HARUHIKO;KUSABE TAKAYA;MOTOIKE TATSUYA |
分类号 |
H01L33/32;H01L33/60;H01L33/64 |
主分类号 |
H01L33/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|