发明名称 LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 Provided are: a light emitting module capable of ensuring a high heat-dissipating property and mountable in any of sets in various shapes; and a method for manufacturing the light emitting module. The light emitting module mainly includes: a metal substrate; an insulating layer covering the upper surface of the metal substrate; a conductive pattern formed on the upper surface of the insulating layer; and a light emitting element fixedly attached to the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, a groove is formed in the metal substrate, and then the metal substrate is bent. Thus, a bent portion is formed in the metal substrate.
申请公布号 US2009090928(A1) 申请公布日期 2009.04.09
申请号 US20080238235 申请日期 2008.09.25
申请人 SANYO ELECTRIC CO., LTD.;SANYO SEMICONDUCTOR CO., LTD.;SANYO CONSUMER ELECTRONICS CO., LTD. 发明人 MORI HARUHIKO;KUSABE TAKAYA;MOTOIKE TATSUYA
分类号 H01L33/32;H01L33/60;H01L33/64 主分类号 H01L33/32
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