发明名称 METHOD FOR PRODUCING AN ELECTRIC COMPONENT-MOUNTED SUBSTRATE
摘要 A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time.
申请公布号 US2009090001(A1) 申请公布日期 2009.04.09
申请号 US20080239356 申请日期 2008.09.26
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 TANIGUCHI MASAKI;FURUTA KAZUTAKA
分类号 H05K13/04;H05K7/10 主分类号 H05K13/04
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