| 摘要 |
PROBLEM TO BE SOLVED: To prevent a bottom part of a treatment chamber from being needlessly heated by blocking infrared rays (radiant heat) directed toward the bottom part of the treatment chamber from a heating element. SOLUTION: This substrate treatment device includes: a mounting base 120 for mounting a wafer W thereon; a heater element 124 arranged in the mounting base for heating the wafer W; a column 200 erected from the bottom part 128 of the treatment chamber 102, and formed out of a pipe-like member having a small pipe part 202, a large pipe part 204 and an intermediate part 206; an outer heat shielding plate 220 arranged to surround the outside of the small pipe part; an inner heat shielding plate 230 arranged to close the inside of the large pipe part. The outer heat shielding plate and the inner heat shielding plate are arranged to overlap the inner edge part of the outer heat shielding plate and the outer edge part of the outer heat shielding plate on each other over the total circumference in a plan view viewed from the mounting base. COPYRIGHT: (C)2009,JPO&INPIT
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