| 摘要 |
PROBLEM TO BE SOLVED: To provide a vertical boat for heat treatment effectively preventing plastic deformation, wafer welding, occurrence of slip dislocation, and metal contamination induced by a high-temperature heat treatment on a semiconductor wafer. SOLUTION: In the vertical boat, four support struts 1a, 1b, 1c and 1d are fixed in an erected state between vertically opposite-disposed circular top plate and bottom plate. Four arm-shaped support strips 2a, 2b, 2c and 2d extending from the support struts toward the inner side of the vertical boat are attached to the respective support struts. Here, for example, the support struts 1a and 1c and the support struts 1b and 1d are adjacent to each other. Support faces 3 are formed near tips of the respective support strips and these four support faces 3 are on the same circumference of the semiconductor wafer W on the inner side of a peripheral edge of the wafer and are separated from one another at equal intervals. The semiconductor wafer W is supported with its rear surface in contact with these four support faces 3. COPYRIGHT: (C)2009,JPO&INPIT |
