发明名称 |
METHODS AND APPARATUS FOR MODIFYING GEL ADHESION STRENGTH |
摘要 |
<p>The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.</p> |
申请公布号 |
WO2006050340(A3) |
申请公布日期 |
2009.04.09 |
申请号 |
WO2005US39423 |
申请日期 |
2005.11.01 |
申请人 |
POLYTECHNIC UNIVERSITY;BARINOV, VICTOR;DABROWSKI, ROBERT;LEVON, KALLE |
发明人 |
BARINOV, VICTOR;DABROWSKI, ROBERT;LEVON, KALLE |
分类号 |
B32B38/10;B32B37/06 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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