| 摘要 |
PROBLEM TO BE SOLVED: To measure the thickness of a platelike workpiece after completion of grinding without leaving the contact trace of the probe of a contact type thickness measuring device and without using an exclusive thickness measuring device. SOLUTION: A grinding unit 30 is fed for grinding to grind a wafer 1 while measuring the thickness of the wafer, and when recognizing that the thickness of the wafer reaches a desired thickness, the probe 52a of the thickness measuring device 50 brought into contact with the surface to be ground of the wafer 1 is separated from the wafer 1. After that, spark out and escape cut are performed, and grinding is completed. After completion of grinding, the rotation of a chuck table 20 is stopped to stop the rotation of the wafer 1, the probe 52a is brought into contact with the surface to be ground of the stopped wafer 1 to measure the thickness of the wafer again, and the finished thickness is checked. COPYRIGHT: (C)2009,JPO&INPIT
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