| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has a high heat resistance without the occurrence of cracks in a packaging resin even if a bonding material fixing a semiconductor chip to a die pad melts. SOLUTION: The semiconductor chip 1 is firmly bonded to a base material 3 by means of the bonding material 4 with a cavity 6. According to the present invention, because the cavity 6 exists inside the bonding material 4, the amount of volume expansion 41 of the bonding material 4 flows into the cavity 6 before the amount of volume expansion 41 causes damage to the packaging resin 5, and although the pressure of gas existing in the cavity 6 rises, the occurrence of cracks in the resin 5 is prevented. |
