| 摘要 |
The invention relates to a method for producing structured, and/or the entire surface spanning, electrically conductive surfaces (3, 11) on an electrically nonconductive carrier 5 (1), wherein in a first step the surfaces (3) of a first level are applied to the carrier (1), in a second step the insulating layer (9) is applied at those positions, at which structured, and/or the entire surface spanning, electrically conductive surfaces (11) of a second level cross the structured, and/or the entire surface spanning, electrically conductive surfaces (3) of the first level, and no electrical contact is to occur between the structured, and/or the entire surface spanning, electrically conductive surfaces of the first level (3) and of the second level (11), in a third step the structured, and/or the entire surface spanning, electrically conductive surfaces (11) of the second level are applied according the first step, and the second and third steps are repeated, if necessary.
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