| 摘要 |
PROBLEM TO BE SOLVED: To provide a test device and a test method of a semiconductor chip which can perform maintenance of a contact probe constituting the test device in a short time in a chip screening test. SOLUTION: When an IGBT chip 20 is broken, a distance between a pressure contact mark of the contact probe 4 and a breakage mark of the IGBT chip 20 attached to an emitter electrode of the IGBT chip 20 is measured, and when the distance is equal to or shorter than a determination reference distance (for example, 0.5 mm), maintenance of a contact block 3 having the contact probe 4 is performed. Hereby, a test device suspension time and maintenance cost can be reduced in comparison with the case where maintenance of the contact probe is performed at every time when the IGBT chip is broken as hitherto. COPYRIGHT: (C)2011,JPO&INPIT
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