| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for preventing a deterioration of yield due to concentration of failures to a specified semiconductor integrated circuit chip by a measuring fault such as a contact. SOLUTION: An inspection device is provided with a plurality of sets of probe groups 105 for inspecting a single chip formed on each semiconductor wafer 111, a probe card 104 holding the probe group 105, a control part 110 moving the probe card 104 so that the probe groups 105 are brought into contact with corresponding chip electrodes on the semiconductor wafer 111, and a detecting part 107 detecting an individual quality decision results from an LSI tester 101 which simultaneously conducts electric tests of a plurality of chips via the probe card 104. When the detecting part 107 detects the failure of the chip in one of a plurality of sets of the probe groups 105, the control part 110 relatively moves the probe card 104 to the semiconductor wafer 111 so that inspection is performed again by using the probe group of the set except for the set used for inspection. COPYRIGHT: (C)2011,JPO&INPIT
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