| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a configuration that eliminates the need for exchanging tools when connecting the tip of each wire to each terminal pin of an intermediate distributing frame after peeling off a covering material at the tip for each wire, and also, eliminates the need for collecting peeled-off chips of the covering materials after the completion of work about a bundled body in which a plurality of wires covered with the covering materials are bundled and the tip sides are branched. <P>SOLUTION: An apparatus 17 used for assisting covering-material peeling-off work or connecting work of a wire is configured as follows. A casing 18 having an internal space 19 is formed with each through-hole 20 through which each branched part of wires 11 is insertable into the internal space 19. Each wire 11 is inserted into the internal space 19 through each through-hole 20 until being abutted against a peeling-off range specifying member 27. Each wire 11 is properly inserted between blade-like members 22, 22 of a covering-material peeling-off mechanism 21 so as to hold each wire 11 and to allow the covering materials 12 in a range from the part, where each wire is inserted between the blade-like members 22, to the peeling-off range specifying member 27 to be peeled off when each wire 11 is extracted. The peeled-off covering materials are left in the internal space 19 as peeled-off chips 12a. Each core material 13 is brought out to the outside of the casing in an exposed state on the tip side. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
