发明名称 DIAMOND DIE
摘要 PROBLEM TO BE SOLVED: To provide a diamond die effectively preventing an increase in resistance and wire breakage during wire drawing. SOLUTION: The diamond die has an approach part 4, a reduction part 5, and a bearing part 6 from the upstream side to the downstream side of the wire drawing flow so as to define a hole 2. In the shape of the hole at the section along the center line of the hole 2, the opening angle closest to the reduction 5 side out of the approach part 4 is≥100°and≤180°, the length of the reduction part 5 is≥0.2D and≤1.0 (D is the diameter of the bearing part 6), while a projecting arc-shaped face 111 is provided on a boundary between the approach part 4 and the reduction part 5, and the radius of the arc-shaped face 111 is≤20μm. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010274282(A) 申请公布日期 2010.12.09
申请号 JP20090127416 申请日期 2009.05.27
申请人 ALLIED MATERIAL CORP;FACTORY-AUTOMATION ELECTRONICS INC 发明人 YUGAWA MINORU;TAKEMOTO KOSUKE
分类号 B21C3/02 主分类号 B21C3/02
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