METHOD FOR MANUFACTURING CIRCUIT BOARD FOR ELECTRONIC PAPER AND METHOD FOR MANUFACTURING ORGANIC THIN FILM TRANSISTOR ELEMENT

摘要

Disclosed is a method for manufacturing a circuit board for electronic paper using a plating method, wherein a fine electrode pattern having excellent adhesion to a substrate can be formed even on a resin substrate on the surface of which no hydroxyl group is present. Also disclosed is a method for manufacturing an organic thin film transistor element for electronic paper, which uses the method for manufacturing a circuit board for electronic paper. The method for manufacturing a circuit board for electronic paper comprises: a step in which a compound represented by general formula (1) is adhered to the surface of a substrate that has an insulating resin layer at least in the surface; a step in which a compound represented by general formula (2) is adhered to the substrate surface; a step in which the substrate surface is subjected to masked exposure; and a step in which an electrode pattern is formed on the substrate surface, which has been subjected the masked exposure, by electroless plating.