发明名称 EMI INTERCEPTION MODULES
摘要 PURPOSE: An EMI(Electromagnetic Interface) shielding module is provided to improve a shielding property against an EMI and noises by forming a shielding conductive layer on the outer side of a printed circuit board. CONSTITUTION: A shielding conductive layer(110) is formed on the outer side of a printed circuit board(100). A device is mounted on the upper side of the printed circuit board. A shield case(120) is mounted on the printed circuit board and covers the device. An upper boarder(111) and an outer surface(112) of the printed circuit board are plated with copper for an oxidation preventing layer.
申请公布号 KR20100129559(A) 申请公布日期 2010.12.09
申请号 KR20090048184 申请日期 2009.06.01
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 YANG, TAE SEOK
分类号 H05K9/00 主分类号 H05K9/00
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