| 摘要 |
PURPOSE: A light emitting package and a method for manufacturing the same are provided to prevent the reliability of reducing due to cracks or a low heat transferring property by forming a metal supporting layer for supporting a light emitting structural layer. CONSTITUTION: A light emitting structural layer(50) includes a first conductive semiconductor layer(20), an active layer(30), and a second conductive semiconductor layer(40). A growing substrate(10) is located on the light emitting structural layer. A passivation layer(60) is formed on the lateral side of the active layer and the second conductive semiconductor layer. An ohmic contact layer(70) is formed under the second conductive semiconductor layer. An electrode(80) is formed under the first conductive semiconductor layer. |
