| 摘要 |
An inversely alternate stacked structure of integrated circuit (IC) modules includes at least one IC module (10), and at least a spring strip set (20). The IC module contains a substrate (11), at least an IC chip and a molding body, in which the substrate has an inner surface (111) and an outer surface (112), at least an external contact pad (113) is provided on one end of the outer surface, and at least a switch contact pad (114) is provided on the other end of the outer surface, the external contact pad and the switch contact pad are disposed in an inversely symmetrical manner. The spring strip set (20) has at least a non-flat structure (21). The external contact pad (113) of an IC module is electrically connected with the switch contact pad (114) of another IC module via the electrical contact of the non-flat structure (21) so that the IC modules are integrated to form an inversely alternate stacked structure. |
