| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic component which can prevent failure due to a bonding process between electronic components, in manufacturing a laminate type electronic component by laminating a plurality of electronic components such as semiconductor elements. <P>SOLUTION: A first electronic component 5 bonded on a substrate is placed on a heating stage 21 and heated. A second electronic component 8 having an adhesive layer 9 formed on its rear surface is held with a normal temperature suction tool 22, and gradually moved down from the upper part of the first electronic component 5. The adhesive layer 9 is caused to contact the first electrode component 5 while softening or melting the layer 9 by radiation heat from the first electronic component 5 and thermal transmission with a first bonding wire 7. The second electronic component 8 is pressurized while continuing heating to thermally cure the adhesive layer 9, thereby bonding the first and second electronic components 5 and 8. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
