| 摘要 |
PURPOSE: A semiconductor memory device is provided to reduce the number of pins outputting the operation state signal by grouping the operation state signals outputted from a plurality of memory chips within the package as one or multiple groups. CONSTITUTION: A chip enable sensor(210) outputs a first signal(S1) and a second signal(S2) at the same time when a chip enable signal is applied to a memory chip(C1). The chip enable sensor comprises a terminal to which the chip enable signal is applied. A chip operation sensor(220) outputs the motion state signal if the first signal is applied.
|
