METALLIC LAMINATE AND MANUFACTURING METHOD OF LIGHT EMITTING DIODE PACKAGE USING THE SAME

摘要

PURPOSE: A metal laminated plate and an LED package manufacturing method thereof are provided to improve the heat dissipation efficiency of an LED by forming the circuit substrate of an LED package to a substrate including a heat dissipation metal layer. CONSTITUTION: A core layer(110) is made of an insulating material. The core layer comprises a heat dissipation filler(111) which is formed into a thermal conductive material. A metal layer(120) is arranged in one side of the core layer. A heat dissipation metal layer(130) is arranged in the other side of the core layer. A metal protection oxide layer(140) is arranged along the outer circumference of the heat dissipation metal layer.