A VIA PASTE COMPOSITION

摘要

PURPOSE: A via paste composition is provided to secure excellent electrical conductivity while coping with a low-temperature process of a non-sintering ceramics hybrid board. CONSTITUTION: A via paste composition is formed with a conductive material and a thermosetting resin. The conductive material contains silver powder, copper powder coated with silver, and a nanosilver particle dispersion solution. The thermosetting resin contains an epoxy resin. The average particle diameter of the silver powder is 100~300 nanometers.