发明名称 |
Imager module packaging having top and bottom glass layers |
摘要 |
An imaging device module includes a circuit mounting layer; a bottom glass layer disposed above the circuit mounting layer; a silicon die disposed above the bottom glass layer; a top glass layer disposed above the silicon layer; and a lens holder disposed above the top glass layer. The silicon die includes an image sensor. The lens holder contains an optical component.
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申请公布号 |
US7807960(B2) |
申请公布日期 |
2010.10.05 |
申请号 |
US20080216319 |
申请日期 |
2008.07.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
STRUM AVI |
分类号 |
H01J40/14 |
主分类号 |
H01J40/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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