METHOD OF FORMING SENSING ELEMENT FOR WARPAGE IN THE ELECTRONIC PACKAGE BOARD AND ELECTRONIC PACKAGE BOARD COMPRISING THE SENSING ELEMENT

摘要

PURPOSE: A warpage sensing element forming method in an electronic package substrate and an electronic package substrate having the same, are provided to detect the occurrence of the warpage by measuring the variation of resistance value through the electrode. CONSTITUTION: A resistance body is formed on the top of a polymer core comprising the printed circuit board. A copper electrode is formed on the top of both ends of the resistance body. The resistance body is coated by a cover coating layer of the printed circuit body. The resistance body is made of Ni-Cr alloy or Ni-Co alloy.