发明名称 SUBSTRATE CUTTING APPARATUS AND METHOD
摘要 PURPOSE: A substrate cutting device and a substrate cutting method thereof are provided to reduce the size thereof by cutting substrates without a substrate rotating unit. CONSTITUTION: A substrate cutting device comprises a first conveyor belt(210), first stages, a pressure regulating unit, and a first scribing unit(240). The first conveyor belt transfers substrates(P) in a first direction(11). The first stages have holes. The holes are located on both sides of a first conveyor belt in a second direction(12). The pressure regulating unit provides pre-set pressure to the holes. The first scribing unit is placed on the top of the first stage.
申请公布号 KR20100107234(A) 申请公布日期 2010.10.05
申请号 KR20090025418 申请日期 2009.03.25
申请人 SEMES CO., LTD. 发明人 LEE, CHUN HO
分类号 B23Q7/00;B26D1/12;B26D3/06;H05B33/10 主分类号 B23Q7/00
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