摘要 |
PURPOSE: A substrate cutting device and a substrate cutting method thereof are provided to reduce the size thereof by cutting substrates without a substrate rotating unit. CONSTITUTION: A substrate cutting device comprises a first conveyor belt(210), first stages, a pressure regulating unit, and a first scribing unit(240). The first conveyor belt transfers substrates(P) in a first direction(11). The first stages have holes. The holes are located on both sides of a first conveyor belt in a second direction(12). The pressure regulating unit provides pre-set pressure to the holes. The first scribing unit is placed on the top of the first stage.
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