发明名称 |
Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces |
摘要 |
A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
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申请公布号 |
US7807066(B2) |
申请公布日期 |
2010.10.05 |
申请号 |
US20050660993 |
申请日期 |
2005.07.11 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
UENOYAMA MAYO;OKUDA YASUHIRO;HAYASHI FUMIHIRO;FUJITA TARO;MASUDA YASUHITO;IDOMOTO YUICHI |
分类号 |
B31D3/00 |
主分类号 |
B31D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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