发明名称 Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces
摘要 A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
申请公布号 US7807066(B2) 申请公布日期 2010.10.05
申请号 US20050660993 申请日期 2005.07.11
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 UENOYAMA MAYO;OKUDA YASUHIRO;HAYASHI FUMIHIRO;FUJITA TARO;MASUDA YASUHITO;IDOMOTO YUICHI
分类号 B31D3/00 主分类号 B31D3/00
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