A HALFECHING HEATSLUG WHICH USES MATRIX TYPE FOR CSP SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A half etching cooling plate for CSP semiconductor package of matrix type is provided to maintain the reliability of a package constantly by minimizing the heat deformation and damage of the package generated during cutting the half etching cooling plate. CONSTITUTION: A cooling plate for a CSP semiconductor package of the matrix type comprises a tie bar of the N*N form. A half etching(2) is enforced on a portion of the tie bar. The half etching(3) is enforced on a circumference of the cooling plate. A mold flash of the CSP semiconductor package of the matrix type diminishes due to the half etching.