发明名称 |
CARRIER FILM-ATTACHED ELECTROLYTE COPPER FOIL, METHOD FOR MANUFACTURING THE SAME, AND COPPER FOIL LAMINATES OBTAINED BY USING THE SAME |
摘要 |
PURPOSE: A carrier foil attached electrolysis copper foil, a manufacturing method thereof, and a copper foil laminate obtained by the carrier foil attached electrolysis copper foil are provided to have a low and stable peeling degree of a carrier foil. CONSTITUTION: When a depth direction profile of a heat resisting metal component is measured forward the carrier foil side using a GDS analysis device in an electrolysis copper foil layer side of a corresponding normal carrier foil attached electrolysis copper foil(1), a half value width of a peak is W1. When a depth direction profile of a heat resisting metal component is measured forward the electrolysis copper foil layer side after heating the carrier foil attached electrolysis copper foil at 300°C for 120 minutes under the air, a half value width of a peak is W2. The relation of ([W2] - [W1]) / [W1] <= 0.3 is satisfied.
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申请公布号 |
KR20100106934(A) |
申请公布日期 |
2010.10.04 |
申请号 |
KR20100026149 |
申请日期 |
2010.03.24 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
TSUYOSHI HIROAKI;OBATA SHINICHI;TATEOKA AYUMU |
分类号 |
B32B15/04;B32B15/20;C25D7/06;H05K1/09 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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