发明名称 Methods and apparatus for conducting heat from an electronic assembly while providing shock protection
摘要 An apparatus is provided that includes an electronic assembly having a panel and a circuit board, a casing surrounding the electronic assembly and at least one isolated member coupled to the casing. The apparatus further includes a shock absorbing material flexibly coupling the electronic assembly directly or indirectly to the at least one isolated member.
申请公布号 US7800065(B2) 申请公布日期 2010.09.21
申请号 US20080167129 申请日期 2008.07.02
申请人 GENERAL ELECTRIC COMPANY 发明人 KONKLE NICHOLAS RYAN;MCBROOM GARY
分类号 G01J1/00 主分类号 G01J1/00
代理机构 代理人
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