发明名称 Heat-dissipating structure applied to at least one portable electronic device
摘要 A heat-dissipating structure includes a support unit and a fan unit disposed in the receiving space. The support unit has a plane portion, a support portion extending downwards from a front side of the plane portion, and an opening passing through the plane portion. The plane portion has a board body, a concave space formed on the top surface of the plane portion, a non-skid pad detachably received in the concave space, a slender block body disposed on a base of the top surface of the board body, and a slender non-skid body disposed on a base of the bottom surface of the board body. The support portion has a support body, a receiving space formed in its inside, a plurality of slender openings formed on two opposite lateral sides of the support body, and a slender non-skid body disposed on a base of the support body.
申请公布号 US7800903(B2) 申请公布日期 2010.09.21
申请号 US20080285180 申请日期 2008.09.30
申请人 COOLER MASTER CO., LTD. 发明人 WANG JEN-YU
分类号 H05K7/20;G06F1/20 主分类号 H05K7/20
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