| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging device, a camera module, an electronic device, and a method of manufacturing the imaging device advantageous in achieving improved reliability, miniaturization, thinness, and reduced weight. <P>SOLUTION: An imaging device 24 includes a wiring board 36, a frame body 38 disposed on one surface of the wiring board 36, an image sensor 40 disposed within the frame body 38 on one surface of the wiring board 36, and a transparent cover 42 disposed on the frame body 38. The wiring board 36 and the frame body 38 are joined by thermosetting adhesive 2. A through-hole 3602 is provided in the wiring board 36. <P>COPYRIGHT: (C)2010,JPO&INPIT |
